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About the Role
Position Summary
The Wire Bond Process Engineer is responsible for developing, sustaining, and improving wire bonding processes for optical transceiver products. The role involves equipment optimization, process development, yield improvement, NPI support, and manufacturing problem resolution.
Qualifications
Education
Bachelor's degree or above in Mechanical Engineering, Electronics Engineering, Manufacturing Engineering, Materials Science, or a related discipline.
Experience
5+ years of hands-on wire bonding experience in semiconductor packaging or optoelectronics manufacturing.
Experience in high-volume manufacturing is preferred.
Technical Skills
Strong understanding of wire bonding processes and bonding fundamentals.
Hands-on experience with Wire Bonder platforms such as:
K&S (Kulicke & Soffa)
ASM
or equivalent equipment
Experience with:
Bond parameter optimization
Recipe development
Bond program creation
Equipment troubleshooti...
The Wire Bond Process Engineer is responsible for developing, sustaining, and improving wire bonding processes for optical transceiver products. The role involves equipment optimization, process development, yield improvement, NPI support, and manufacturing problem resolution.
Qualifications
Education
Bachelor's degree or above in Mechanical Engineering, Electronics Engineering, Manufacturing Engineering, Materials Science, or a related discipline.
Experience
5+ years of hands-on wire bonding experience in semiconductor packaging or optoelectronics manufacturing.
Experience in high-volume manufacturing is preferred.
Technical Skills
Strong understanding of wire bonding processes and bonding fundamentals.
Hands-on experience with Wire Bonder platforms such as:
K&S (Kulicke & Soffa)
ASM
or equivalent equipment
Experience with:
Bond parameter optimization
Recipe development
Bond program creation
Equipment troubleshooti...
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