Wire Bond Equipment Staff Engineer

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the‑art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Equipment Maintenance & Troubleshooting

• Perform preventive and corrective maintenance on wire bonders (e.g., Shinkawa, ASM, etc.).
• Diagnose and resolve equipment‑related issues to minimize downtime.
• Lead root cause analysis (RCA) for recurring failures and implement corrective actions.

Process Optimization

• Optimize wire bonding parameters (e.g., force, ultrasonic power, temperature) to improve yield and throughput.
• Conduct DOE (Design of Experiments) to enhance process stability and performance.
• Work with process engineers to qualify new materials (wire types, capillaries) and bond pad desig...