Thermosonic Wire Bond Engineer — Process Yields

Onsemi in the Philippines is seeking a Wire Bond Process Engineer to optimize thermosonic wire bond processes. This role demands extensive semiconductor manufacturing experience, focusing on interconnect quality and yield reliability.

The ideal candidate should hold a BS degree in Engineering and possess at least three years of relevant experience. Skills in bond metallurgy and SPC are crucial. The position includes a full-time schedule with responsibilities that encompass ensuring effective process controls and leading problem-solving initiatives.