About the Role
Your mission
The future of AI computing is light, not electrons.
Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.
As our Team Lead Co-Packaged Optics, you are the architectural and leadership anchor of our next-generation semiconductor packaging. You will build, coach, and scale a brand-new CPO Packaging Team from the ground up, driving the transition from concept phase to high-volume production. This role is about establishing absolute technical ownership at the intersection of photonics and electronics, bridging the gap between internal cutting-edge chip design and external global OSAT manufacturing.
Your Responsibilities
- Leadership & Team
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