← Back to opportunities

Staff Process Engineer ( Dicing/ Grinding/ LLO/ Bonding)

📍 Location
, , malaysia
⏰ Job Type
Full-time
📅 Posted
June 05, 2026

About the Role

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

  • To sustain and optimize dicing/ grinding/ LLO/ Bonding process & equipment for continue improvement, countermeasures issue, ensuring tool maximum productivity, new product qualification & release.
  • To perform risk assessment using FMEA and derive control when needed. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to quality standard & customer requirement
  • Interaction with Equipment engineer to understand the Process & Equipment capability that influence towards the processes. To work with Product Integration Engineer/FPD/NPI to understand the product integration and process
  • ...

Ready to Join Through a Referral?

Apply now and get connected directly with the hiring team

Apply for this Position