← Back to opportunities
About the Role
About the role
If you are passionate about pushing technical boundaries while leading teams to deliver real impact in the field, this is your opportunity to make it happen.
We are looking for a driven Die Bond Product Engineering Manager to lead the next generation of die attach technology, shaping how our equipment performs in real customer applications. In this role, you will own the intersection of machine innovation, process expertise, and customer success, turning complex semiconductor requirements into cutting‑edge, high‑performance solutions.
What You Will Be Doing
- Own the process application and performance of the die bonder product portfolio across key packaging segments
- Define product requirements, use‑case scenarios, and application benchmarks for new platforms or modules
- Lead die attach development, qualification, and NPI ramp to high‑volume manufacturing
- Drive yield, reliability, and downtime red...
Ready to Join Through a Referral?
Apply now and get connected directly with the hiring team
Apply for this Position