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Own and maintain SPC control strategies for bonding processes across multiple toolsets.
Define Critical Process Parameters (CPPs) and Critical Quality Attributes (CQAs) such as alignment accuracy, bond strength, defectivity, war...
About the Role
Bonding Process Control Engineer ? Role Summary
We are seeking a Bonding Process Control Engineer responsible for owning, optimizing, and sustaining wafer?level bonding processes?including hybrid wafer?to?wafer bonding, chip?to?wafer bonding, and Temporary Bonding & Debonding (TBDB) across multiple wafer sizes and thicknesses.
This role focuses on process stability, SPC governance, yield improvement, defect reduction, and robust process-control strategies for both development and small?volume prototying. The engineer will play a critical role in enabling next?generation heterogeneous integration and advanced packaging technologies.
Key Responsibilities:
Process Control & SPC Ownership
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