Principal Advanced Packaging Architect for HPC/AI Chips

A leading technology company in Bitcoin mining is looking for a Staff / Principal Advanced Packaging Engineer to take charge of packaging architecture, technology strategy, and manufacturing for next-gen HPC and AI silicon. The role involves defining the packaging roadmap, managing cross-functional collaboration, and ensuring reliable mass production. Ideal candidates will have over 8 years of experience in semiconductor packaging, strong project management skills, and the ability to drive complex programs independently. The position offers ample opportunities for personal and professional development.
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