About the Role
The Role and Impact
As a Packaging Module Development Engineer within Intel's Assembly Technology Development (ATD) team, you will be at the forefront of innovation, driving the advancement of cutting-edge semiconductor packaging technologies that power the future of computing. Your work will enable Intel's leadership across mobile, edge, and hyperscale computing platforms by developing and optimizing industry-leading package assembly solutions. This dynamic role offers the unique opportunity to collaborate with cross-disciplinary teams, innovate across materials, equipment, and processes, and scale advanced packaging platforms for high-volume manufacturing. Your contributions will directly impact quality, reliability, and manufacturability, ensuring Intel's roadmap stays ahead of the curve in delivering transformative technologies.
Key Responsibilities
- Develop First Level, Second Level, and Mid-Level Interconnect (FLI, SLI, ...
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