NPI Engineer: Die & Wire Bonding Process Lead

PALOMAR TECHNOLOGIES (SE ASIA) PTE. LTD. is recruiting an NPI Engineer based in Singapore. The ideal candidate will develop new semiconductor assembly processes and qualify customer products for manufacturing. You will lead various aspects of new product introduction, ensuring robust and repeatable processes.

The role requires at least a Bachelor’s degree in a relevant engineering field and 2-5 years of experience in semiconductor assembly. Key skills include die bonding, wire bonding, and experience in design of experiments.