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HBM (High Bandwidth Memory) / DDR / LPDDR PHY I/Os PCIe, USB, Ethernet, MIPI, and proprietary interfaces Lead ESD–I/O co‑design trade‑off decisions, balancing: Aggressive ESD targets (HBM / CDM / MM).Ultra‑low capacitance and leakage requirements Eye margin, jitter, bandwidth, return loss, and impedance matching Drive architectural choices for: Snapback clamps, rail clamps, diode steering...
About the Role
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Responsibilities will include, but are not limited to ESD Architecture Leadership & Strategy
Define and own ESD architecture and protection strategy for high-speed I/O portfolios including:
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