Microelectronic Bonder Level 2

**Description:**
You will be the Microelectronic Bonder for Lockheed Martin Missiles & Fire Control in Chelmsford, MA. Our team is responsible for fabricating and modifying hybrid microcircuits and sub‑assemblies that support critical defense systems.
**What You Will Be Doing**
As the Microelectronic Bonder, you will be responsible for executing high‑precision wire‑bonding and hybrid circuit fabrication tasks.
Your responsibilities will include, but are not limited to:
+ Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies.
+ Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques.
+ Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds, or chip placement.
**Why Join Us...