Intern Package Development (FA & CA)

• Attach to Semiconductor Package development Board Level Reliability R&D lab.
• Assist engineer for FA with report writing tasks and WLCSP construction analysis.

• Practical hands‑on training of relevant lab equipment and X‑sectioning.
• Semiconductor assembly process training.
• Wafer Level Chip Scale (WLCSP) process training.
• Type of Failure Analysis and flow step training.
• Company orientation and workplace safety training.

• Diploma in Electronic Engineering or Electronic & Computer Engineering or similar.
• Willingness to work hands‑on, teamwork spirit, and good communication skills.
• Basic knowledge of semiconductor (not compulsory).
• Proficiency in Microsoft Office (PowerPoint, Excel, Word).
• English business proficiency.

We do not tolerate discrimination. We aim to recruit and retain a di...