← Back to opportunities
💼
Imaging Package Design Engineer — High-Impact Tech
Teledyne Technologies Incorporated • sevilla, Spain
About the Role
A leading technology company is seeking a Package Design Engineer to lead the design of advanced microelectronic packages in Seville, Spain. The role involves identifying customer needs, implementing design solutions, and managing technical interactions with vendors. Candidates should have a background in microelectronics or electronics, with experience in packaging design and a strong command of English and French. This position offers innovative projects, a flexible work environment, and a commitment to work-life balance.
#J-18808-Ljbffr
#J-18808-Ljbffr
Ready to Join Through a Referral?
Apply now and get connected directly with the hiring team
Apply for this Position