IC Package Design Engineer

Walk-In Drive: IC Package Design Engineer (3+ Years)
Weekend Hiring Drive – HCLTech | Bangalore (Jigani Campus)
HCLTech is hiring skilled professionals for the role of

IC Package Design Engineer . If you have a passion for advanced package and PCB design, we invite you to attend our walk-in drive!
Interview Details
Date:

16 May 2026 (Saturday)
Time:

9:00 AM – 2:00 PM
Venue:

Tower 4, GF café 3 , HCLTech, Jigani Campus, Bangalore
Mode:

Face-to-Face (F2F)
SPOC:

Mareeswari C M
Role:

IC Package Design Engineer
Experience:

3+ Years
Key Responsibilities & Required Skills
Strong experience in

IC Package / Substrate Design

(mandatory)
Hands-on experience with

Cadence APD (Allegro Package Designer)
Good understanding of

package/substrate design and assembly rules , especially for

flip chip designs
Exposure to various package technologie...