About the Role
Job Overview
Delivers signal integrity, power integrity and radio frequency and electromagnetic compatibility solutions for large, complex high-speed platforms, boards, packages, and silicon. Develops and analyzes 2D and 3D model extraction across die/C4 bumps, silicon, package, sockets, and boards. Defines specification/rules, reviews implementation, documents characterization and measurement reports, and improves and optimizes design margins. Develops test structures, electrical analysis methodology and verification plans to address challenges. Performs measurements to characterize and correlate with electrical specifications after design and correlates back to pre‑silicon analysis and estimations. Documents and provides implementation guidelines to the end customers as part of the platform design guide. Collaborates with IP design teams and silicon integration teams to ensure the IP and SoC designs maximize the platform level solution space to meet targeted product la...
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