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About the Role
NPI Engineer – Soldering Process, Diebond and Wirebond
Onsemi is looking for a skilled and driven NPI Engineer to lead the introduction and optimization of soldering, diebond, and wirebond processes for new product lines in a high‑tech manufacturing environment. The role is essential in ensuring robust process integration, high‑yield production, and a seamless transition from development to manufacturing. This position reports to the Director, New Product Engineering.
Responsibilities
- Lead the development and implementation of soldering, diebond, and wirebond processes for new product introductions (NPI).
- Collaborate with R&D, Process Engineering, and Manufacturing teams to ensure soldering, diebond, and wirebond processes meet design and reliability requirements.
- Define process parameters, control plans, and qualification strategies for soldering, diebond, and wirebond operations.
- Conduct DFM reviews with a focus on...
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