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About the Role
Position Summary
The Die Bond Process Engineer is responsible for developing, optimizing, and sustaining die attach processes used in optical transceiver manufacturing. This role focuses on equipment setup, process control, yield improvement, new product introduction (NPI), and continuous manufacturing excellence.
Qualifications Education- Bachelor's degree or above in Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, Materials Science, Electronics Engineering, or a related technical discipline.
- 5+ years of hands‑on die bonding experience in semiconductor packaging or optoelectronics manufacturing.
- Experience in high‑volume manufacturing environments is preferred.
- Strong understanding of die attach processes, including:
- Epoxy Die Bonding
- Eutectic Die Bonding
- Flip‑Chip Assembly
- Hands‑on experience with di...
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