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Associate Equipment Engineer (Grinding/Dicing/LLO/Bonding)

📍 Location
, , malaysia
⏰ Job Type
Full-time
📅 Posted
June 07, 2026

About the Role

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Responsibilities

  • To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
  • Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
  • Carry out calibration/ preventive maintenance to the machine and equipment.
  • Ensure the availability of materials and spare parts. Maintains records of daily, monthly and yearly maintenance programs.
  • Performs other project related to improve production operation. Assist process engineer to carry ...

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